Intel’s upcoming Nova Lake processors are going to feature some new changes in their platform design, with one of the biggest shifts being in the supporting chipset (PCH).

Specifically designed to enhance the "Reverse Hybrid" assembly process for next-gen electronics, offering superior ...

flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking ...

Next-generation Nova Lake CPUs from Intel will reportedly require a new motherboard, shifting to an LGA1954 socket.

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” ...

You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

Discover the top 3 undervalued Semiconductors & Semiconductor Equipment stocks for Friday, April 18 based on AAII’s Stock ...

Microsoft’s model BitNet b1.58 2B4T is available on Hugging Face but doesn’t run on GPU and requires a proprietary framework.

The DS1050A Embedded Security Testbench from Keysight targets security flaws in modern chips and embedded systems.

The Banana Pi BPI-CM6 is a computer-on-a-module that’s the same size and shape as a Raspberry Pi CM4 and even uses the same ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...