Finanznachrichten14d
Altera Corporation: Altera FPGAs Pushing the Boundaries of Innovation at the Intelligent Edge
The MAX 10 10M40 and 10M50 product lines are now offered in variable pitch BGA packages. This new package option significantly increases the value of these highly integrated devices by reducing ...
Morningstar15d
Altera FPGAs Pushing the Boundaries of Innovation at the Intelligent Edge
The MAX 10 10M40 and 10M50 product lines are now offered in variable pitch BGA packages. This new package ... accelerate their FPGA AI development process and get to market faster.
Network World15d
Altera targets low-latency AI edge applications with new FPGA products
Altera is also expanding the MAX 10 FPGA family with new package options. The MAX 10 10M40 and 10M50 product lines are now offered in variable pitch BGA packages. This new package option ...
Design-Reuse16d
High Density FPGA Package BIST Technique
With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).
GitHub2y
Python package for process-oriented climate modeling
These are self-describing, and should run out-of-the-box once the package is installed ... Version 0.8.2 (released November 2023) New feature: process class climlab.radiation.InstantInsolation() which ...