The Intel Core Ultra 9 275HX handily outperforms its predecessor in PassMark, but with AMD's Fire Range inbound, the performance crown is still up for grabs.

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Keysight provides an end-to-end LPDDR6 memory design and test platform that improves device and system validation.

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

The memory market is evolving due to the rising demand for high-performance computing, AI, and energy-efficient mobile applications. LPDDR6 significantly enhances performance and efficiency to support ...

Abstract: Since the voltage amplitude of the arc suppression device is different during the normal operation and single line-to-ground fault, the problems of high cost and low module utilization rate ...

We believe the robust demand for MLCCs, mainly from smartphone and automotive manufacturers, will be the driver of Semco’s growth in the midterm. Over the past decade, the growth of passive components ...

22-caliber rifle, rifle ammunition and multiple commercially produced explosive devices agents reported being the “same style of device Ball would later tell agents the threw at officers on ...

WASHINGTON: Newly inaugurated US President Donald Trump ordered a 75-day pause on enforcing a law that would effectively ban TikTok, marking one of his first acts in office. The executive order ...

Research Institute Lee Chang-min noted, "The continued strong demand for multilayer ceramic capacitors (MLCC) and flip-chip ball grid arrays (FC-BGA ... of MLCC and packaging substrates." ...

DDR4 ball grid array package develops partial connection defect during device operation. Electrical model of defect is presented and Ansys software is used to extract resistance, inductance and ...