Keysight provides an end-to-end LPDDR6 memory design and test platform that improves device and system validation.

Test complexity has grown with the adoption of next-generation memory devices such as LPDDR6, HBM4, and GDDR7. These ...

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Research Institute Lee Chang-min noted, "The continued strong demand for multilayer ceramic capacitors (MLCC) and flip-chip ball grid arrays (FC-BGA ... of MLCC and packaging substrates." ...

We believe the robust demand for MLCCs, mainly from smartphone and automotive manufacturers, will be the driver of Semco’s growth in the midterm. Over the past decade, the growth of passive components ...

Keysight Technologies, Inc. KEYS recently unveiled its new Low-Power Double Data Rate 6 (LPDDR6), a cutting-edge design and test solution to support the evolution of memory systems. This comprehensive ...

The variety of memory devices available today provides the system architect ... All DDR2 memory chips use the FBGA (Fine Ball Grid Array) package. This allows higher memory densities in a smaller ...

DDR4 ball grid array package develops partial connection defect during device operation. Electrical model of defect is presented and Ansys software is used to extract resistance, inductance and ...

But as device geometries shrink, and as performance targets increase ... connected to the package through a solder ball in much the same way that a ball grid array (BGA) package is connected to a ...

An LPDDR6 test solution helps check memory performance, speeds up testing, and saves power for AI, computing, mobile devices, data centres.